Wafer Trimming Machine - メーカー・企業と業務用製品 | イプロスものづくり

Wafer Trimming Equipment SST-M01T

Flatten the wafer surface and remove irregularities with ion beam

This wafer trimming equipment contributes to precision machining because it can flatten the unevenness of the wafer surface to σ=1.0nm or less by irradiating a φ4 inch or φ6 inch wafer with converged ion beam.