Wafer Trimming Equipment SST-M01T
Flatten the wafer surface and remove irregularities with ion beam
This wafer trimming equipment contributes to precision machining because it can flatten the unevenness of the wafer surface to σ=1.0nm or less by irradiating a φ4 inch or φ6 inch wafer with converged ion beam.
- Company:昭和真空
- Price:Other