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Wafer Trimming Machine Product List

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Wafer Trimming Equipment SST-M01T

Flatten the wafer surface and remove irregularities with ion beam

This wafer trimming equipment contributes to precision machining because it can flatten the unevenness of the wafer surface to σ=1.0nm or less by irradiating a φ4 inch or φ6 inch wafer with converged ion beam.

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  • Wafer Trimming Machine

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